Austin, TX
We're hiring
Frontier AI models now demand multi-TB/s memory bandwidth for real-time inference. This is far beyond what DDR or PCIe can deliver within edge power and thermal budgets. Granular closes this gap by co-designing a new type of packaging architecure, targeting up to 5 TB/s of aggregate die-to-die bandwidth within edge robotics' power and thermal envelope.
Roles we're building toward
Thermal Engineer
You'd own our cooling roadmap end to end.
Package Design Engineer
You'd drive our packaging architecture decisions — working through real tradeoffs between different approaches to connecting our dies, in partnership with our fabrication partners.
Physical Design Engineer
You'd take our interconnect and packaging concepts into physical implementation.
Process/Manufacturing Engineer
You'd bring fab-side depth to move our designs from process-feasible to reliably manufacturable - working closely with our partners and understanding the practical failure modes that don't show up until you're actually building at scale.
Business/Partnerships
You'd help drive commercial traction - conversations with potential customers, pilot programs, and funding opportunities. Tell us which side interests you most.
You may be a good fit if you have
- —Hands-on experience with advanced packaging, chiplets, thermal management, or interconnect design (or you're a PhD/grad student doing this kind of research and want to see it become real hardware)
- —A bias toward building and testing things yourself, not just modeling or advising
- —Comfort with ambiguity - we're pre-prototype, things will change
Strong candidates may also have
- —Experience with UCIe, die-to-die interconnects, or memory systems
- —Background in cooling or packaging process engineering
- —Compiler or systems software experience if the hardware orchestration layer sounds more like your thing
None of these an exact match? If you work on chiplets, thermal, or packaging, or system software for hardware, tell us anyway.
How to get in touch
Message us directly with what you're working on now, why this problem grabs you, and your resume or Linkedin.
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